How is a chip born? What are the production stages? Roughly speaking, before the chip becomes a commodity, it is necessary to complete the design through the chip design company, Qualcomm, MediaTek, etc. are chip design companies, the use of EDA industrial software, chip architecture, after the completion of the design and development of a chip.

Then the designed chip to the chip manufacturer, they are responsible for their own OEM processing, to analyze the actual development of the production enterprise manufacturing.

If the chip is to be put on the market, these three tests are necessary.

1, performance test

In the chip manufacturing process,wafer test there are countless steps that may introduce defects. Even with the same batch of wafers and packaging products, the chip has its own advantages and disadvantages, which need to be tested and screened.

2、Function Test

After the completion of the chip production, in order to apply different programs, its parameters, indicators, functions have certain requirements, need to test whether it meets the standard.

3、Reliability test

Chip through the function and performance tests, get a good chip, but the chip in winter will not be the most annoying static electricity damage,wafer level testing in thunderstorms, three volts, snow days can work properly, the chip can be used for a month, a year, ten years and so on. All of these must be evaluated through the reliability test.

So companies want to achieve through these tests, we can be specific what means to use?

1.SLT test

SLT is the abbreviation for System Level Test, which is a board level or system level test. They also connect the test host to the packaged chip through the test board and test socket. the purpose of SLT test is to improve the product yield and reduce production costs.

2 Reliability Test

Mainly for the chip to impose a variety of harsh environments, such as ESD static electricity, that is, simulating the human body or industrial body to the chip with instantaneous large voltage. Another example is HTOL's test bench, high-temperature working life test, which is accelerated by high temperature and voltage acceleration for a certain period of time to predict the future normal working life of this electronic device.

HTOL test

1. Using open socket + probe structure, high precision, stable testing, failure analysiswhile greatly reducing the design and processing costs of integrated circuits, reducing the cost of use;.

2. According to the actual test situation, choose different probes, you can test different ICs with solder ball pad tips.

3.External heat sink for solving the problem of high power control components heat dissipation technology ;

Easy to install, no need to weld, open top/flap structure, suitable for manual/automatic operation;.