Printed circuit board stamping often appear some problems, such as foaming problems, internal graphics displacement problems, layer dislocation problems, plate warping problems, how to solve these problems? 1oz vs 2oz Here is a little makeup to understand.

white exposed glass cloth weave

1, reduce the temperature or pressure;

2, reduce the pre-pressure;

3, Adjust the start time of applying high pressure after carefully observing resin flow, how to test a circuit board with a multimeter pressure change and temperature rise during lamination;

4, adjust the pre-pressure temperature control and processing industry high pressure starting working time.

Foaming

1. increase the pre-pressure;

2. Reduce the temperature, increase the prepressure or shorten the prepressure period;

3. Pressure, temperature and fluidity should be coordinated according to the time-activity relationship curve;

4. Reduce the prepressure period and temperature rise rate, or reduce the volatile content;

5. Strengthen cleaning operations;

6. increase the pre-pressure or replace different adhesive sheets;

Check that the heater matches and adjust the hot mold temperature.

There are pitting, resin and wrinkles on the board.

Carefully clean the steel plate to make the surface of the copper foil smooth;

When arranging the plate, pay attention to the alignment of the upper and lower plates, reduce the operating pressure, select the film with low RF%, shorten the resin flow time and speed up the temperature.

The inner pattern shift

The solution:

1. use a high-quality and inner coated foil board;

2. Reduce the pre-pressure or replace the adhesive sheet;

3. Adjust the template.

4. uneven thickness, the inner layer slipping

Adjust to the total thickness is consistent;

Adjust the thickness and select the copper clad plate with small thickness deviation; Adjust the parallelism of the hot pressing film plate, limit the freedom of the laminate multi-answer sheet and place the laminate in the center area of the hot pressing template as much as possible.

1. control the characteristics of the bonded sheet;

2. The plate is preheated;

3. Select the inner copper clad plate and adhesive sheet with good dimensional stability.

4. board bending, board warping

The dislocation between the layers

1. Strive for density symmetry and lamination of layout design to be placed symmetrically on the film;

2, ensure curing cycle;

3, strive for the same direction of cutting;

4. The development of materials produced by the same production plant in a product portfolio mold will be beneficial to us;

The multilayer plates are heated under pressure above the TG and then cooled under pressure below room temperature.

Stratification, heat stratification

1. Before laminating, bake the inner layer to remove moisture;

To improve the storage environment, the adhesive must be removed from the vacuum drying environment within 15 minutes after use;

3. Improve the operation to avoid contact with the effective area of the bonding surface;

4, strengthen the cleaning after the operation of self-oxidation technology; Monitor the PH value of data cleaning water;

5. Shorten the oxidation time, adjust the concentration of the oxidation liquid or the operating temperature aromatics, increase micro-etching, and improve the surface state.

If you also encounter the eight problems in the article, do you know how to solve them?