Probe Card

The High Frequency Probe Card is a tool for testing high frequency chips and wafers. It can extract and analyze high frequency signals. It consists of probes, wires and connectors, and can be divided into two types: distributed parameter and centralized parameter.

High-frequency probe card is the interface between high-frequency test instruments and the circuit under test, and is usually used for detecting high-frequency signals such as RF and microwave. It needs to have the characteristics of high-speed transmission of high-frequency signals, impedance matching with the circuit under test, as low as possible distortion, good contact performance and stable connection capability.

The principle of high-frequency probe card is to extract high-frequency signals from the circuit board through electromagnetic induction,wafer testing and transmit the signals to the test equipment for analysis through wires. Among them, the distributed parameter probe card works based on the electromagnetic field propagation principle, and the aggregate parameter probe card works based on the capacitance or inductance principle.

According to students use different scenarios and performance development characteristics, high-frequency probe card can be mainly divided into through a variety of data types. For example, the spring-type probe card is suitable for carrying out the test of on-board and off-board signals, which can realize the rapid insertion and removal; the pin-type probe card is suitable for intensive testing, which can improve the simultaneous us testing of multiple control signal points; the magnetic ring-type probe card is suitable for testing of high-frequency magnetic field signals, which can be used to effectively extract the electromagnetic wave; the laser-type probe card is suitable for testing of the technical high-speed, high-frequency optical signals, which can be more accurately managed to test the optical signal The laser probe card is suitable for testing high-speed, high-frequency optical signals, which can more accurately manage the testing of optical signal timing and waveforms.

High-frequency probe card is widely used in wireless communication, RF circuit design, microwave measurement and high-speed signal transmission and other fields. In the field of wireless communication, it is usually used for testing and debugging of high-frequency signals in wireless devices.wafer probe In RF circuit design, RF signals in RF circuits are tested and debugged to ensure the performance and reliability of the circuits. In microwave measurement, the interface connection between the microwave tester and the circuit under test is used to measure various parameters of the microwave signal. In high-speed signal transmission, the interface between the high-speed transmission equipment and the circuit under test is connected in order to test the transmission performance and stability of high-speed signals.

The following points need to be noted when using high-frequency probe cards: First, avoid mechanical damage when contacting,probe holder because the contact part of the high-frequency probe card is prone to damage such as impact or bending. Secondly, it is necessary to prevent high temperature and humid environment from causing damage to it, and it needs to be used in a dry and suitable temperature environment. In addition, attention should be paid to anti-static interference to avoid the impact on the circuit. In addition, when testing high frequency circuit boards, they need to be properly grounded to avoid errors. Finally, due to the high testing accuracy of high frequency probe cards, care needs to be taken when using them to avoid any impact on the test results.

In conclusion, high-frequency probe card is an important tool for chip and wafer testing, which can extract and analyze high-frequency signals. This article introduces the definition, principle, classification, application scope and precautions of high-frequency probe card, hoping to help you better understand high-frequency probe card and apply it in practice.


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How should wafers be kept in storage?

Die and wafers should be kept in a vacuum-sealed container and kept in a clean, dry, inert atmosphere (such as nitrogen) with a relative humidity of no more than 30%. They should also be stored between 18 and 24 degrees Celsius.