Generally speaking, circuit boards with more than 10 layers are called multilayer PCB boards, which are very different from traditional multilayer boards. For example, processing and production is more difficult, and product stability is higher. Due to its wide range of applications, it has great potential for development. At present, most of the domestic manufacturers of multilayer PCB boards are Sino-foreign joint ventures, or even directly operated by foreign enterprises. Multi-layer PCB boards require a high level of technology and a large initial investment. It not only requires advanced equipment, but also tests the technical level of the staff. Coupled with the cumbersome user certification process, which makes many manufacturers do not have the ability to produce multilayer PCB boards, so multilayer PCB boards still have considerable market prospects.

　　The following are a few points that I think should be noted in the production process of multilayer pcb fabrication:.

　　1. Alignment

　　The more layers, the higher the requirements for inter-layer alignment. Generally speaking, the tolerance of interlayer alignment control in 75 μ m, due to the size, temperature and other factors, the multilayer board interlayer alignment control of the difficulty factor will be very large.

　　2. Inner layer line

　　The materials used to make multilayer boards are also very different from other boards, for example, the surface of the multilayer board has a thicker copper skin. This requires a higher degree of difficulty in laying out the inner layer lines. If the inner core board is thinner, it can easily lead to abnormal exposure, which may be mainly due to the occurrence of folds. Generally we say that the unit structure of multilayer boards is relatively large in size, plus the social production and management costs have a very high. Once the students appear a problem, for the development of Chinese enterprises will be a huge loss. It is very likely that there is no incoming and outgoing.

　　3. Pressing

　　It is called multilayer board,PCB factory there will be a process of pressure. And a little carelessness in this process will lead to delamination, slippery boards and other phenomena. So we must consider the properties of the material when designing. The more layers there are, the more difficult it is to control shrinkage and dimensional coefficient compensation, and problems ensue. If the insulation is too thin, test failures may occur. So in this urgent process more attention should be paid to the fact that more problems will occur at this stage.

　　4. Drilling

　　Because of the special materials used in the production of multilayer boards, the drilling of holes has become much more difficult. Drilling technology will also be a test. Because of the increased thickness, drilling is easy to break the knife, there may be oblique drilling and a series of problems, we should pay more attention!